폼 팩터 |
3U Rack-mount with three modules |
프로세서 |
2x 3rd Gen Intel® 제온® Scalable processors per node |
메모리 |
- Up to 2.0TB using 32x 64GB 3200MHz TruDDR4 3DS RDIMMs per node
- 인텔® Optane™ Persistent Memory 200 시리즈
|
Base Module |
- Up to 4x double-wide, full-height, full-length FHFL GPUs each PCIe Gen4 x16
- Up to 8x 2.5” Hot Swap SAS/SATA/NVMe, or 4x 3.5” Hot Swap SATA (selected configurations)
|
Dense Module |
- Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen4 x16 on PCIe switch
- Up to 6x EDSFF E.1S NVMe SSDs
|
HGX Module |
- NVIDIA HGX A100 4-GPU with 4x NVLink connected SXM4 GPUs
- Up to 8x 2.5” Hot Swap NVMe SSDs
|
RAID Support |
SW RAID standard; Intel® Virtual RAID on CPU (VROC), HBA or HW RAID with flash cache options |
I/O Expansion |
Up to 4x PCIe Gen4 x16 adapters (2 front or 2-4 rear) and 1x PCIe Gen4 x16 OCP 3.0 mezz adapter (rear) depending on the configuration |
Power and Cooling |
- Four N+N redundant hot-swap PSUs (up to 2400W Platinum)
- Full ASHRAE A2 support with internal fans and Lenovo Neptune™ liquid-to-air hybrid cooling on HGX A100
|
관리 |
Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO) |
OS Support |
- 레드햇 엔터프라이즈 리눅스, 수세 리눅스 엔터프라이즈 서버, 마이크로소프트 윈도우 서버, VM웨어 ESXi
- Tested on Canonical Ubuntu
|
Datasheet |
Lenovopress.com/ds0123 |